Electronics Solder Paste 185-240°C Sn63-Pb37 15g

الوصف

Solder Paste 15g for PCB/SMD/BGA/PGA Solder Paste for repairing electronic boards, PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances by using tin soldering iron, hot air soldering station and SMT/BGA rework station. Specifications: Particle Size:30-45 Micron Alloy: Sn63/Pb37 Melting Point: 185-240 Celsius Features: Suitable to stencil printing (holes larger than 0.45mm). Good conductivity and oxidation resistance. High purity and soft soldering. Bright and full solder joints. No residue solid after rework and easy cleaning. Halogen free. Usage: Repairing electronic boards such as PCB/SMD/BGA/PGA for PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances. Reballing BGA chipset with reballing stencil (holes larger than 0.45mm). Repairing phones, as well as replacement SMD component, micro switches and charging connectors. Soldering electrical control boards. Soldering all copper alloys, wires, lithium ion batteries and solderable surfaces as nickel strips. Usage Recommendations (very important): Follow safety precautions & notes. Clean the surface (Clear any residues or dust). Put a very little bit of solder paste before soldering. Use a suitable soldering iron tip with the target area. Use a suitable soldering iron with the target size. Use a suitable soldering station with the target component. Use a wet soldering sponge for cleaning the tip and during soldering. Use thinner or any alcohol for cleaning. Notes: For best results, follow the usage recommendations. Don’t put soldering iron tip in the solder paste. Not suitable with welding by fusion or flame. Safety Precautions: Close after using & keep away from children. Use enough water when eyes or wounds are touched. Appearance: The solder paste is a soft paste, packaged in a round plastic can -net weight 15g. 📌 الضمان على جميع الأصناف هو ضمان 3 أشهر من تاريخ الشراء Thanks for Your Trust

من صفحة المورد.