Universal BGA Reballing Stencil Plate 33 in 1
EGP 180
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The Universal BGA Reballing Stencil Plate (33 in 1) is a practical and efficient tool designed for reballing and repairing BGA (Ball Grid Array) components. This stencil plate consolidates 33 popular chip layouts into a single, compact design. Crafted for precision and durability, it is an essential accessory for electronic repair professionals and DIY enthusiasts dealing with micro soldering and chip rework. Features: 53 Layouts in One Plate where accommodates various BGA chip sizes and patterns, enhancing its utility and compatibility. Durable Material where made from high-quality stainless steel for long-lasting performance and resistance to heat and wear. High Precision where laser-cut holes for accurate solder paste application and reballing. Compact Design where lightweight and portable, making it easy to integrate into repair toolkits. Universal Compatibility where supports a wide range of chip manufacturers and configurations. Designed for multiple uses, ensuring cost-effectiveness. Heat-Resistant where withstands high soldering temperatures without deformation. Specifications: Item Type: BGA Reballing Stencil Plate Material: Stainless steel Color: Silver Finish: Polished for smooth handling and durability Number of Layouts: 33 Thickness(Approx.): 0.1 mm Standard Size Dimensions(L x W): 19.5 cm x 8.5 cm Hole Accuracy: ±0.01 mm Compatibility: Suitable for ICs, CPUs, GPUs, and other BGA components Applications: Electronics Repair. Chip Reballing. Prototype Development. Training and Education. DIY Electronics Projects.
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