MEHSEE Soldering Wire 0.4mm 63/37 50gm
EGP 50
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Features Tin(Sn): 63% Lead(Pb): 37% Wire diameter: 0.4mm Weight :50gm Good solderability, insulation resistance, No spattering and Non-corrosive Widely used in electrical and electronics, solder parts like circuit boards, electronics devices and others
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