Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Solder Paste for Mobile Phone BGA Repair
EGP 320
See other suppliers →Description
Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Solder Paste for Mobile Phone BGA Repair Features: RL-404 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repair Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store Low Melting Point /High Density/High Resistance Strong Activity/Strong Welding Force Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution Meet the maintenance needs of motherboards for Huawei and Apple high-end machines Package includes: 1 x Tin Paste A low temperature lead-free solder paste customized for high-end motherboard repair Tin lighting / climbing tin strong / high purity / temperature standard / easy to store Low temperature tin paste melting point temperature Low melting point Effective protection of circuit board components Backed by value tin technology Not only the skilled craftsmanship, but also need
From the supplier's page.
makhzan doesn't sell — every offer opens the supplier's own site.