OSEPP LS-00019 Breadboard – 830 Tie Points

Description

OSEPP LS-00019 Breadboard – 830 Tie Points The OSEPP LS-00019 Breadboard – 830 Tie Points is an essential tool for electronics enthusiasts, hobbyists, and professionals engaged in circuit prototyping and experimentation. Manufactured by OSEPP Electronics Ltd., this solderless breadboard provides a reliable platform for building and testing electronic circuits without the need for soldering, allowing for quick iterations and modifications. It features a total of 830 tie points, strategically divided into one central terminal strip offering 630 points and two distribution strips providing 200 points, which facilitates organized power distribution and signal routing in complex designs. Features: 830 tie points for building a wide variety of electronic circuits. Reusable design, ideal for prototyping and testing circuits without soldering. Self-adhesive backing for added stability during use. Power rails for easy power distribution. Clear grid system for easy component placement. Compatible with standard 2.54mm pitch components. Ideal for both small and medium-sized projects. Specifications: Parameter Value Total Tie Points 830 Terminal Strip Points 630 Distribution Strip Points 200 Dimensions 55.88 x 165.1 mm Hole Spacing 2.54 mm Wire Compatibility 20-29 AWG Material ABS Plastic Applications: Prototyping electronic circuits for hobbyist projects. Educational demonstrations in electronics and STEM courses. Testing microcontroller-based systems with Arduino or Raspberry Pi. Building sensor networks and simple automation devices. Rapid development of proof-of-concept designs in engineering. Package Include: 1x OSEPP LS-00019 Breadboard – 830 Tie Points.

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