RELIFE RL-404 138°C Low Temperature Solder Paste
EGP 235
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Product Description RELIFE RL-404 solder paste is a special type of low-melting solder paste (tin in the form of a paste) intended for soldering electronic components, i.e. SMD, BGA, e.g. in repair processes. Thanks to the very low melting point of exactly 138 ° C , the use of the paste in this process allows you to perform complex repairs (e.g. replacing the CPU in the iPhone) without exposing other phone components to damage. Features: A low-temperature lead-free solder paste customized for high-end motherboard repair Tin lighting/climbing tin strong/high purity/temperature standard / easy to store Low-temperature tin paste melting point temperature Low melting point Effective protection of circuit board components Backed by value tin technology Specifications: Particle size (um): 20-38 Conductivity (%fCu): 14.0 Flux content (Wt%): 9±0.5 Viscosity(25°C Pa.s): 178±10 Weight: 40g
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