RELIFE RL-404S Solder Paste 138°C

Description

RELIFE RL-404S Solder Paste 138°C The RELIFE RL-404S is a premium lead-free solder paste engineered for low-temperature applications with a melting point of 138°C. This paste is specifically designed for high-end motherboard repair, including Surface Mount Device (SMD) and Ball Grid Array (BGA) components, making it an excellent choice for precision electronics assembly and repair. Its fine particle composition ensures excellent wettability and strong, reliable solder joints. Features Environmentally Friendly : Lead-free and halogen-free formula ensures safety and compliance with environmental standards. Low Melting Point : At 138°C, it minimizes heat exposure, protecting sensitive components. Fine Particle Size : Particles sized 20-38 µm ensure smooth application and strong bonds. Strong Welding Ability : High resistance and activity produce bright, durable solder joints. No-Clean Formula : Leaves no residue, saving time on cleanup. Syringe Dispenser : Enables precise application with minimal waste, including three different specification needles and a putter. Specifications Attribute Value Brand RELIFE Model RL-404S Melting Point 138°C Particle Size 20-38 µm Flux Content 9±0.5% Viscosity 178±10 Pa.s at 25°C Storage Temperature 0–10°C Volume 10CC Weight 15g Application High-End Motherboard Repair : Tailored for devices like Huawei and Apple smartphones, ensuring precision in complex repairs. SMD and BGA Soldering : Ideal for surface-mount and ball grid array components, common in modern electronics. Precision Electronics Assembly : Suitable for assembling sensors, wires, motors, fuses, connectors, metal shells, and lighting components. SMT Repair and BGA Chip Tin Planting : Supports surface-mount technology repairs and chip tinning processes. LED Patches and More : Versatile for various electronic repair tasks, including LED applications. Package Content 1 x RELIFE RL-404S Solder Paste 3 x Needles of different specifications 1 x Putter

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