Breadboard 400 Tie Point
EGP 40
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Solderless breadboards are simple way to quickly prototype and set up your projects. This universal high quality solderless breadboard features 400 tie points with 0.1" pin spacing. It is 5.5 cm x 8.5 cm with a standard double-strip in the middle and two power rails on both sides and a gap down the center to allow ICs to be used on the board. The boards have connectors on the sides to allow multiple boards to be snapped together. Features White Universal Solderless Breadboard 400 Contacts High Quality Transparent ABS plastic material Terminal Strip, Tie-point 300 Distribution strip, Tie-point 100 Completely reusable Colored coordinates for easy component placement Phosphor bronze nickel plated spring clips Accepts a variety of wire sizes (29-20 AWG) Dimensions(cm): 8.5 x 5.5 x 0.85
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