MECHANIC UV50 Flux Paste
EGP 165
See other suppliers →Description
Product Features High synthetic BGA Solder Paste Tin Rosin-Based Flux Paste Cream. PH value neutral, insulation is strong, welding surface smooth. Professional Soldering Tin Flux for PC Cards Electronic Chip-level Welding. Its boiling point is only slightly higher than the melting point of the solder. Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding, and so on. Good soldering and welding tools. IC and PCB for no corrosive Super compacity: Applicable to PCB, BGA, SMD, PGA repair repair, Soldering, etc. Rosin-based Solder Paste. Product Specifications Material: Plastic+ Rosin-based solder paste Type: Rosin-based BGA solder flux cream Model Number: UV50 Viscosity: 0.2Pas Granularity: 0.22um Application: for Phone BGA Board Soldering Fixing Function: PC Cards Electronic Chip-level Welding Instructions: 1. Wipe the surface of the object before soldering 2. Apply the paste flux to the solder joint 3. Solder the tin to the solder joint with a soldering iron.
From the supplier's page.
makhzan doesn't sell — every offer opens the supplier's own site.