Rework Liquid Flux 125mL for Repairing SMT/BGA Chipset Solder Balls
EGP 125
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Rework Liquid Flux 125mL for Repairing SMT/BGA Chipset Solder Balls For repairing (SMT/BGA) chipset solder balls, soldering and reballing of chipset for PCs, laptops, smartphones and all sensitive electronic components by using tin soldering iron, hot air soldering station and SMT/BGA rework station. Features: • Quick repairing of oxidized solder balls for chipset without lifting. • Fast reflow and evenly spread under (BGA) chipset. • High quality and activity. • Non conductive, non corrosive and fungus resistant. • No residue after rework and easy cleaning. Usage: • This flux can be used in both automated and manual soldering applications, it is great for general purpose soldering of electronic boards, wires, semiconductors and SMD/SMT/BGA. • It is also ideal for solder coating or tinning leads, it may be applied by spray, or foam for tin soldering applications. Usage Recommendations: • Clean the surface (Clear of any residues or dust). • Put a little bit of flux. • Use soldering iron with soldering wick. • Use hot air soldering station for (SMT) ICs rework at (max180°C). • Use thinner or any alcohol for cleaning. Notes: • For best results, follow the usage recommendations. • Suitable with dip or wave soldering. • Not suitable with welding by fusion or flame. Safety Precautions: • Close after using & keep away from children. • Use enough water when eyes or wounds are touched. Appearance: The flux is a light yellow liquid, packaged in a transparent plastic bottle – (Net Capacity) 125mL. Thanks for Your Trust
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