HC-131 Heatsink Thermal Compound Paste

Description

HC-131 Heatsink Thermal Compound Paste The HC-131 Heatsink Thermal Compound Paste 15g is a white thermal interface compound designed to improve heat transfer between heat-generating electronic components and their heatsinks. It fills microscopic air gaps and surface irregularities between mating surfaces, helping establish a more efficient thermal path from the component to the heatsink. Features: White thermal interface compound for electronic cooling applications. 1.93W/m·K published thermal conductivity. 0.225°C·in²/W published thermal resistance. Designed to improve thermal transfer between components and heatsinks. Helps fill microscopic air gaps and surface irregularities. Electrically insulating thermal compound. Specifications: Parameter Value Model HC-131 Product Type Heatsink Thermal Compound Compound Type Silicone Thermal Paste Color White Thermal Conductivity 1.93W/m·K Thermal Resistance 0.225°C·in²/W Electrical Resistivity 5.0×10¹⁵Ω·cm Operating Temperature -50°C to +200°C Thermal Interface Component to Heatsink Electrical Property Electrically Insulating Net Weight 15g Applications: CPU and processor heatsink applications. GPU and graphics processor cooling. MOSFET thermal management. IGBT thermal management. Power transistor cooling. Voltage regulator cooling. Rectifier and power semiconductor cooling. High-power LED thermal management. Power supply thermal management. Audio amplifier cooling. Industrial electronic equipment. Electronic repair and maintenance. Package Include: 1x HC-131 Heatsink Thermal Compound Paste.

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