Relife RL-406 227°C 40g High-temperature Lead-free Solder Paste Middle Layer Tin Planting
EGP 300
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Relife RL-406 – Solder Paste Halogen-free 227°C (40g) The Relife RL-406 is a high-temperature , halogen-free solder paste that is engineered for demanding soldering applications where precision and safety are paramount. This solder paste is designed to meet the needs of advanced electronic repairs , including middle layer tin planting for devices. Features Halogen-Free : Ensures environmental safety and compliance with strict industry standards. High-Temperature Operation : With a melting point of 227°C, it is suitable for complex soldering tasks that require higher temperatures. Strong Welding Ability : Provides high resistance, strong activity, and a bright, full tin finish. Excellent Wettability : Maintains a wet surface for up to 36 hours after opening, ensuring consistent soldering quality. Versatile Use : Ideal for a wide range of applications, including SMT repair, BGA chip tin planting, and LED patches. Technical Parameters Brand : Relife Model : RL-406 Melting Point : 227°C Particle Size : 20-38µm Viscosity (25°C) : 160-230Pa.s Flux Content : 9±0.5 Wt% Weight : 40g Storage Conditions : Store at 0-10°C Relife RL-406 227°C 40gm High-temperature Lead-free Solder Paste Middle Layer Tin Planting Relife RL-406 227°C 40gm High-temperature Lead-free Solder Paste Middle Layer Tin Planting 00
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