Universal BGA Reballing Stencil Plate 53 in 1

Description

Universal BGA Reballing Stencil Plate 53 in 1 The Universal BGA Stencil Plate is a versatile tool designed for repairing and reballing Ball Grid Array (BGA) components. This stencil plate combines 53 different BGA layouts in a single sheet, making it suitable for a wide range of chip sizes and configurations. Its high-precision design ensures consistent alignment and reliable soldering results, ideal for professionals and DIY enthusiasts in the electronics repair industry. Features: 53 Layouts in One Plate where accommodates various BGA chip sizes and patterns, enhancing its utility and compatibility. Durable Material where made from high-quality stainless steel for long-lasting performance and resistance to heat and wear. High Precision where laser-cut holes for accurate solder paste application and reballing. Compact Design where lightweight and portable, making it easy to integrate into repair toolkits. Universal Compatibility where supports a wide range of chip manufacturers and configurations. Designed for multiple uses, ensuring cost-effectiveness. Heat-Resistant where withstands high soldering temperatures without deformation. Specifications: Parameter Value Item Type: BGA Reballing Stencil Plate Material: Stainless Steel Color: Silver Finish: Polished for smooth handling and durability Number of Layouts: 53 Thickness (Approx.): 0.1 mm Standard Size Dimensions (L × W): 19.5 cm × 9.5 cm Hole Accuracy: ±0.01 mm Compatibility: Suitable for ICs, CPUs, GPUs, and other BGA components Applications: Electronics Repair. Chip Reballing. Prototype Development. Training and Education. DIY Electronics Projects. Package Contents: 1x Universal Stencil BGA Reballing Plate 53 in 1

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