Electronics Paste Flux 30g for PCB/SMD/BGA/PGA
EGP 110
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Electronics Paste Flux 30G for PCB/SMD/BGA/PGA Flux, Tin soldering paste flux 30g for repairing electronic boards, PCs, Laptops, Smartphones, and all sensitive electronic components by using a tin soldering iron, hot air soldering station, and SMT/BGA rework station. Features: Compatible with all tin alloys. Suitable to refill all types of paste flux syringes. No residue solid after rework and easy cleaning. High purity and soft soldering. Strong insulation over 100 mega ohms. Halogen-free. Usage: Repairing electronic boards such as PCB/SMD/BGA/PGA for PCs, Laptops, Smartphones and all sensitive electronic components. Soldering electrical control boards. Soldering all copper alloys and wires. Usage Recommendations (very important): Follow safety precautions & notes Clean the surface (Clear any residues or dust). Put a very little bit of paste flux before soldering. Use a suitable soldering iron tip with the target area. Use a suitable soldering iron with the target size. Use a wet soldering sponge for cleaning the tip and during soldering. Use thinner or any alcohol for cleaning. Notes: For best results, follow the usage recommendations. Don’t put the soldering iron tip in flux. Not suitable with welding by fusion or flame. Safety Precautions: Close after using & keep away from children. Use enough water when eyes or wounds are touched. Appearance: The flux is a white soft paste, packaged in a round metal can – net weight 30g. Thanks for Your Trust
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