MECHANIC Solder Paste XGSP30 20gm 183°C
EGP 125
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MECHANIC Solder Paste XGSP30 20gm 183°C The MECHANIC Solder Paste XGSP30 20gm 183°C is a professional-grade soldering material engineered for high-precision electronic assembly and repair tasks. Formulated with a eutectic alloy composition of 63% tin (Sn) and 37% lead (Pb), this solder paste provides a stable and reliable melting point at 183°C, ensuring consistent performance during reflow and manual soldering processes Features: Eutectic Sn63/Pb37 alloy composition for precise and consistent melting performance. Stable melting point of 183°C for reliable reflow soldering. Smooth paste consistency for accurate and controlled application. Excellent wetting capability for strong and uniform solder joints. Low-residue, no-clean formulation for improved efficiency. Specifications: Parameter Value Model XGSP30 Alloy Composition Sn 63% / Pb 37% Melting Point 183°C Particle Size 20-38 μm Type Leaded solder paste Content 20 g Applications: SMD component soldering and rework. BGA reballing and repair processes. Mobile phone and tablet motherboard repair. PCB assembly and prototyping. Consumer electronics maintenance. Precision electronic circuit repairs. Package Include: 1x MECHANIC Solder Paste XGSP-30 20gm 183°C
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