RL-044 RELIFE Precision BGA Stencils

Description

RL-044 RELIFE Precision BGA Stencils The RL-044 RELIFE Precision BGA Stencils are professional-grade tools designed for reballing and repairing Ball Grid Array (BGA) components. These stencils are precision-engineered to cater to a wide range of BGA layouts, ensuring accurate alignment and efficient soldering. Constructed from high-quality stainless steel, they are ideal for both repair technicians and electronics enthusiasts looking for reliable, reusable, and versatile solutions for BGA rework. Features: High Precision Design where Laser-cut apertures for precise solder paste application and perfect chip alignment. Durable Material where crafted from stainless steel for enhanced durability and heat resistance. Multiple Layouts where accommodates a variety of BGA chip configurations, making it suitable for a range of devices. Heat Resistant where withstands high soldering temperatures without deformation. Lightweight and Compact where easy to handle and store, perfect for on-the-go technicians. Designed for repeated use, providing long-term cost efficiency. Polished Surface where smooth finish ensures effortless cleaning and prevents damage to components. Universal Application where compatible with CPUs, GPUs, ICs, and other BGA chips. Specifications: Brand: RELIFE. Model: RL-044 Material: Stainless steel Number of Layouts: 16 Thickness(Approx.): 0.1 mm Hole Accuracy: ±0.01 mm Standard Size Dimensions(L x W): 10 cm x 8 cm Package Size(L x W): 130 mm x 120 mm Surface Finish: Polished and heat-treated for enhanced durability Applications: Chip Reballing. Electronics Repair. PCB Maintenance. Prototype Testing. Education and Training. DIY Electronics Projects. Package Contents: 1x RL-044 RELIFE Precision BGA Stencils

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