4816P-AGC-272 SMD BUSSED RESISTOR NETWORKS 2.7KΩ SOIC-16

Description

4816P-AGC-272 SMD BUSSED RESISTOR NETWORKS 2.7KΩ SOIC-16 The 4816P-AGC-272 is a surface-mount bussed resistor network featuring multiple 2.7kΩ thick-film resistors integrated into a compact SOIC-16 package. This resistor array is designed to reduce PCB space usage, simplify assembly, and minimize the number of discrete resistor components required in digital and embedded electronic systems. The bussed configuration connects one side of all resistor elements to a common pin, making the device suitable for pull-up, pull-down, line termination, and signal conditioning applications. Features: Bussed schematic with 8 resistors arranged in 4 pairs. Medium body SOIC package for compact SMT designs. Reflow solderable for modern assembly processes. Compatible with automatic surface mounting equipment. Thick film resistive elements for stable performance. Low temperature coefficient of ±100ppm/°C. Excellent TCR tracking of ±50ppm/°C maximum. Specifications: Parameter Value Type Thick Film Resistor Network Schematic Bussed (2 Circuit) Number of Resistors 8 (arranged in 4 bussed pairs) Resistance Value 2.7KΩ (2,700Ω) Tolerance ±2% (Standard), ±1% (F) and ±0.5% (D) available Power Rating per Element 0.16W at +70°C Package Power Rating (Max at +70°C) 1.28W Temperature Coefficient (TCR) ±100ppm/°C (50Ω and above) TCR Tracking ±50ppm/°C maximum Maximum Operating Voltage 50V Operating Temperature Range -55°C to +125°C Storage Temperature Range -55°C to +150°C Insulation Resistance >10,000MΩ minimum Dielectric Withstanding Voltage 200VRMS Lead Coplanarity 0.102mm (0.004″) max. at mounting Flammability UL94V-0 Lead Frame Material Copper, solder coated Body Material Thermoplastic Package Type SOIC-16 (Small Outline Integrated Circuit) Pin Count 16 Mounting Style Surface Mount (SMD) Applications: Digital logic pull-up and pull-down networks. Open collector pull-up circuits. Wired OR pull-up configurations. Line termination networks. Long-line impedance balancing. Power driven pull-up applications. TTL input pull-down networks. DRAM applications. SCSI applications. Package Include: 1x 4816P-AGC-272 SMD BUSSED RESISTOR NETWORKS 2.7KΩ SOIC-16 Datasheet

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