MAANT SOLDER PASTE MY-17A 217℃ DEGREES BGA SOLDERING TIN FLUX
EGP 300
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MaAnt Lead/Lead-free Solder Paste MY17A. MaAnt BGA Soldering Tin Flux Paste 217℃ for electronic IC Phone motherboard soldering repair. MaAnt solder paste for PCB and small components welding. Parameters: Model: MY17A. Melting Point: 217℃. Alloy: Sn98.5Ag1.0Cu0.5 G Microns: 20-38um, storage: 0-10 c weight: 50g Models: MY-17A: 217℃. Note: solder paste flux can only be sent out by special post mail. Features: 1. 100% brand new and high quality. 2. Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on. 3. Good soldering and welding tool. 4. Material: solder paste.
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