BGA Liquid Flux 50ml
EGP 45
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Repairing BGA Chipset Solder Balls for PCs, Laptops and Smartphones. Features Quick repairing of oxidized solder balls for chipset without lifting. Fast reflow and evenly spread under BGA chipset. High quality and activity. Not corrosive and easy cleaning. For Using Put a little bit of Flux. Use only hot air soldering station for SMT ICs rework. Use any solvent such as, thinner or any alcohol for cleaning. Safety Precautions: Close After Using. Keep Away from Children. Appearance: The flux is a yellow liquid, packaged in a transparent plastic bottle, capacity 50ml.
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