Universal BGA A90 Reballing Stencil Plate 35 in 1

Description

Universal BGA A90 Reballing Stencil Plate 35 in 1 The Universal BGA Reballing Stencil Plate A90 (35 in 1) is a versatile and high-precision tool designed for reballing BGA (Ball Grid Array) chips in various electronic devices, including smartphones, laptops, gaming consoles, and more. It features 35 different stencil patterns, providing compatibility with a wide range of chip sizes. This flexibility makes it an ideal choice for both professionals and hobbyists working with BGA components. Crafted from durable, heat-resistant stainless steel, the A90 stencil plate ensures longevity and precision even under high temperatures. The clearly labeled stencil patterns allow for quick and accurate selection, streamlining the reballing process. Whether used with a hot air rework station or a reballing machine, this tool delivers reliable and consistent results. Compact, portable, and cost-effective, the A90 (35 in 1) eliminates the need for multiple separate stencils. It is an essential tool for anyone involved in micro-soldering or BGA chip repairs, offering unmatched efficiency and quality in electronics repair tasks. Features: The Universal BGA Reballing Stencil Plate A90 (35 in 1) is a durable, precise, and cost-effective solution for BGA chip reballing. Its 35 patterns, high-quality stainless steel construction, and compatibility with various devices make it an essential tool for anyone involved in electronics repair. Specifications: Material : High-Quality Stainless Steel The stencil plate is made from premium, heat-resistant stainless steel that can withstand the high temperatures required during the reballing process, Able to withstand high temperatures of up to 350°C (662°F), making it suitable for use with hot air rework stations or automatic reballing machines without distortion. 35 Unique Patterns The A90 stencil plate comes with 35 different stencil patterns, offering compatibility with a wide variety of BGA chip sizes and pitches, making it versatile for various electronics repair tasks. Dimensions : Size : Compact and lightweight, with a design optimized for easy handling and storage. Thickness : Typically around 0.3mm to 0.5mm, ensuring precision while maintaining durability. Precision : High Precision Cut Each stencil pattern is cut with exceptional accuracy to ensure the precise placement of solder balls, crucial for proper connections and functionality after the reballing process. Reusability : Long-lasting The stainless steel construction ensures that the stencil plate can be reused multiple times without any loss of performance or quality. Applications: Smartphone Repairs Laptop and PC Repairs Gaming Consoles Electronics Prototyping and Repairs Package: 1x BGA Reballing Stencils for A90 MTK series Why Choose the Universal BGA Reballing Stencil Plate A90 (35 in 1)? This stencil plate is the go-to tool for any technician or DIYer involved in BGA chip-level repair. The 35-in-1 design makes it an incredibly versatile option, providing the precision and reliability needed for high-quality reballing. Whether you’re repairing smartphones, laptops, or gaming consoles, the Universal BGA Reballing Stencil Plate A90 (35 in 1) will ensure that you achieve professional results with ease, making it a must-have in your repair toolkit.

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