Heat Bed High Power MOSFET Module 25A
EGP 160
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Heat Bed High Power MOSFET Module 25A Hot bed high-power expansion module, compact appearance, unique snowflake heat sink appearance design, more powerful heat dissipation, solve the problem of excessive heat bed power and current load, this module under normal heat dissipation, measured I (Max) = 25A It can work stably for a long time, and the current should not exceed 30A during use. This high power module is a general add-on heated bed power expansion module for 3D printer. The module can be used with any 3D printer motherboards. With this add-on module to board lead the maximum current up to 25A. When using heated bed 3D printer for 12V power supply which may cause excessive current during times, with this module, it can well protect the connectors on the controller board from burning. This module is based on power MOSFET allows load current up to 25A. Specifications: Item: Power MOSFET Input Voltage: 12~50Vdc Recommended Voltage: 12~24Vdc Max. Current: 25A Distance between holes: 62.8*37.8mm Size of suitable fan:30mm*30mm Size: 70*45*29mm Product weight: 65g Applicable for: Any 3D Printer Heated Bed Package Includes: 1x High High Power MOSFET Module 2x Power Supply Wires. Datasheet: MOSFET Datasheet Related Products: CNC | 3D PRINTER PARTS
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