MECHANIC TP63 Silicone thermal paste Suitable 3g
EGP 230
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MECHANIC TP63 Silicone thermal paste Suitable 3g MECHANIC TP63 Silicone thermal paste Suitable for heat conduction and dissipation of transistors and electronic tubes Designed for hardware players with efficient thermal conductivity , Efficient heat conduction , Long lasting coldness , Farewell to high temperatures , good Insulation . EFFICIENT HEAT CONDUCTON PERSISTENT COLD SENSATION Effectively reducing CPU temperature for mobile phones/computers Ensure stable operation and extend service life HIGH SECURITY GOOD INSULATION Has good insulation, non conductive and non corrosive electrical components Even novice users will not damage the components High performance heat dissipation Can be used for high-performance CPUs, GPUs, or chipsets, as well as users who require high thermal conductivity for overclocking CPU/GPU
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