Rosin Tin Paste Flux 10gm
EGP 15
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Rosin Tin Paste Flux 10gm Rosin Tin Paste Flux 10 g is a high-quality soldering flux formulated to remove oxidation from metal surfaces and enhance the wetting of solder. It helps molten solder spread evenly, resulting in strong electrical and mechanical connections. It’s based formulation makes it suitable for most electronic soldering tasks, including PCB assembly and component rework. This paste flux is easy to apply and ideal for both leaded and lead-free soldering processes. It is widely used by technicians, hobbyists, and manufacturers to reduce soldering defects such as cold joints and bridging. The compact 10 g container makes it convenient for bench use, repairs, and field work while minimizing waste. Features: Soldering flux. Improves solder wetting and flow. Helps remove surface oxidation. Reduces soldering defects. Easy-to-apply paste form. Suitable for PCB and wire soldering. Compatible with leaded and lead-free solder. Specifications: Parameter Value Flux type Rosin Physical form Paste Net weight 10g Color Amber / Yellowish Residue type Residue Cleaning requirement Alcohol-based cleaner Application method Manual (brush / tip) Applications: PCB soldering and rework. Through-hole and SMD soldering. Wire tinning. Connector and terminal soldering. Electronics repair and maintenance. Packages: 1x Rosin Tin Paste Flux 10gm.
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