MECHANIC UV50 Flux Paste (Copy)
EGP 85
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MECHANIC UV50 Lead-Free Soldering Flux Paste Features: No-Clean Formula: Leaves minimal residue, eliminating the need for post-soldering cleaning. Mild pH: Neutral pH ensures no corrosion to ICs or PCBs. High-Quality Rosin: Contains refined, acid-free flux for superior soldering performance. Semi-Solid Consistency: Non-drip formula for easy application. Versatile Application: Suitable for mobile phone repairs, PCB, BGA, and electronic component soldering. Specifications: Model: UV50 Weight: Approximately 35 grams Color: Yellow Viscosity: 0.2 Pa·s Granularity: 0.22 micrometers pH Level: Neutral Applications: Mobile Phone Repair: Ideal for motherboard and component soldering. PCB Soldering: Suitable for various printed circuit board soldering tasks. BGA Soldering: Effective for ball grid array component soldering. SMD Rework: Assists in surface-mount device rework and repair. General Electronics Repair: Versatile flux for various electronic soldering applications.
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