



WYLIE WL-716L Multifunctional High-Temperature Resistant Tin Plating Silicone Pad
From the shop's description
WYLIE WL-716L Multifunctional High-Temperature Resistant Tin Plating Silicone Pad The WYLIE WL-716L Silicone Pad is a multifunctional repair tool specifically designed for BGA rebilling, CPU IC tinning, and small board soldering tasks. Built with high-temperature resistant silicone, it provides a stable and safe working platform for delicate soldering processes. The integrated magnetic system firmly holds steel stencils in place, preventing movement during heating and ensuring accurate solder ball placement. One of its key advantages is the automatic levelling and pressure-release behaviour under heat, which prevents stencil deformation and avoids issues like solder bridging or uneven tin distribution. The pad also features heat dissipation holes to maintain stability during high-temperature operations, along with grooves and storage slots for better workflow organization. Its durable, anti-slip, and easy-to-clean silicone construction makes it ideal for professional technicians and repair workshops. Features: High-temperature resistant silicone material. Strong magnetic adsorption for stencil stability. Automatic levelling under heat to prevent deformation. Heat dissipation hole design for better performance. Anti-slip and anti-static properties. Easy to clean and reusable. Built-in grooves and storage slots for convenience. Durable, flexible, and corrosion-resistant construction. Specifications: Parameter Value Model WL-716L Brand WYLIE Material Silicone + Magnetic Base Size ~110 × 92 mm Weight ~80g – 100g Temperature Resistance High Temperature Type Magnetic Rebilling Pad Application BGA / CPU / IC Repair Applications: BGA reballing and solder ball placement. CPU and IC tinning (reballing). Mobile phone motherboard repair. PCB precision soldering. Use with steel mesh (stencil) during rework. Electronics repair workshops and labs. Package Includes: 1 × WYLIE WL-716L Silicone Magnetic Tin Plating Pad.
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