HM501 Thermal Grease 20g

From the shop's description

HM501 Thermal Grease 20g HM501 Thermal Grease is a high-performance thermal interface compound formulated to maximize heat transfer between heat-generating components (like CPUs, GPUs, or LEDs) and their heatsinks. It has a smooth, viscous consistency allowing for uniform spreading on mating surfaces, which helps minimize thermal resistance caused by microscopic air gaps. The formula is designed to remain stable under thermal stress, enabling reliable long-term performance even in demanding environments. This grease is made using a silicone-based carrier combined with thermally conductive particles, which allows it to efficiently conduct heat while preserving electrical insulation. Its compound structure resists separation or “pump-out” under repeated thermal cycling, meaning it stays effective for a long time without drying, cracking, or flowing away. Because of its non-conductive nature, it’s suitable for sensitive electronics where contact with electrical pins or traces must be safe. Manufacturers produce HM501 in a variety of package sizes for example, syringes or small tubes — making it easy to apply just the right amount for each use. Whether in consumer PCs, power electronics, or compact embedded devices, HM501 helps maintain optimal operating temperatures and improves the longevity and reliability of components. Its balanced performance (good conductivity and good stability) makes it a go-to choice for both system builders and repair technicians. Features: High thermal conductivity Electrically non-conductive (insulating) Wide working temperature range (e.g., –50 °C to ~280 °C) Stable viscosity; resists pump-out under repeated thermal cycling Non-toxic, halogen-free, non-corrosive Flame retardant quality Specifications Parameter Value Thermal conductivity: ~1.5 – 2.3 W/m·K Thermal impedance / resistance: < 0.225 °C-in²/W Specific Gravity / Density: > 2.0 g/cm³ Viscosity: –50 ~ 300 (units vary) Operating temperature range: –50 °C to approx. 280 °C (peak) Dielectric / Electrical Property: Insulating / Good electrical insulation Silicon compound: 50 % Carbon compound: 30 % Oxidized metal compound: 20 % Applications: Modules with high thermal conductivity requirements. Cooling device between chassis or frame. High-speed large storage drive. car engine control. Hard Disk Drive and DVD Drive. power conversion equipment. High power LED. Laptops and Desktops. network communication equipment. Household appliances, electronic components, electricians, etc. Package Contents: 1x HM501 Thermal Grease 20g