RELIFE RL-401 30G THERMAL TIN SOLDERING PASTE 183 C
EGP 150Out of stock at Micro Ohm
Price may be out of date. Last checked 74 days ago. Confirm it on the shop's page.
From the shop's description
RELIFE RL-401 30G THERMAL TIN SOLDERING PASTE 183 C Description RELIFE Solder Paste Flux-RL-401 183°C Solder Tin Sn63/Pb67 20-38um 30gm, RELIFE Solder Paste, Unique manufacturing of solder past technology, giving a new definition of tin-base technology. Features: 183°C Solder paste with high quality. The solder core is very strong. Less residual. No-Clean. Unique manufacturing of solder past technology, giving a new definition of tin-base technology. Package includes: 1pc x RL401 Solder Paste
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