RL-044 RELIFE Precision BGA Stencils

RL-044 RELIFE Precision BGA Stencils The RL-044 RELIFE Precision BGA Stencils are professional-grade tools designed for reballing and repairing Ball Grid Array (BGA) components. These stencils are precision-engineered to cater to a wide range of BGA layouts, ensuring accurate alignment and efficient soldering. Constructed from high-quality stainless steel, they are ideal for both repair technicians and electronics enthusiasts looking for reliable, reusable, and versatile solutions for BGA rework. Features: • High Precision Design where Laser-cut apertures for precise solder paste application and perfect chip alignment. • Durable Material where crafted from stainless steel for enhanced durability and heat resistance. • Multiple Layouts where accommodates a variety of BGA chip configurations, making it suitable for a range of devices. • Heat Resistant where withstands high soldering temperatures without deformation. • Lightweight and Compact where easy to handle and store, perfect for on-the-go technicians. • Designed for repeated use, providing long-term cost efficiency. • Polished Surface where smooth finish ensures effortless cleaning and prevents damage to components. • Universal Application where compatible with CPUs, GPUs, ICs, and other BGA chips. Specifications: • Brand: RELIFE. • Model: RL-044 • Material: Stainless steel • Number of Layouts: 16 • Thickness(Approx.): 0.1 mm • Hole Accuracy: ±0.01 mm • Standard Size Dimensions(L x W): 10 cm x 8 cm • Package Size(L x W): 130 mm x 120 mm • Surface Finish: Polished and heat-treated for enhanced durability Applications: • Chip Reballing. • Electronics Repair. • PCB Maintenance. • Prototype Testing. • Education and Training. • DIY Electronics Projects. Package Contents: • 1x RL-044 RELIFE Precision BGA Stencils