Oxygen Pressure Sensor XGZP101SB1 100KPa Definition B1 SOP-6

From the shop's description

Oxygen Pressure Sensor XGZP101SB1 100KPa Definition B1 SOP-6 The XGZP101SB1 is a high-performance silicon-based piezoresistive pressure sensor from CFSensor’s XGZP160 series, specifically configured for 100kPa pressure measurements with B1 pin definition. This surface-mount sensor utilizes advanced MEMS technology where the pressure sensor die is bonded onto a substrate with a protective plastic cap, creating a compact and reliable sensing solution. The sensor operates on the principle of piezoresistive effect, where applied pressure causes resistance changes in the silicon die, producing a millivolt-level output that corresponds to the measured pressure. With its small form factor SOP-6 package, this sensor is ideal for applications requiring precise pressure monitoring in confined spaces. Designed primarily for non-corrosive gases and air, the XGZP101SB1 offers excellent repeatability, linearity, and long-term stability. The sensor requires external amplification and temperature compensation circuitry to convert its raw millivolt output into usable signals for microcontrollers or control systems. The B1 pin configuration follows specific connection definitions as outlined in the datasheet, ensuring proper integration into circuit designs. While designated as an “Oxygen Pressure Sensor,” it is important to verify compatibility with oxygen applications with the manufacturer, as standard specifications cover general non-corrosive gas use. The sensor’s robust construction and wide operating temperature range make it suitable for various industrial, medical, and consumer applications where reliable pressure sensing is essential. Features: MEMS technology with solid-state reliability. Piezoresistive pressure sensing principle. Gage pressure type (positive and vacuum pressure measurement capable). Suitable for non-corrosive gas or air media. Compact SOP-6 surface-mount package. Unamplified millivolt output. RoHS compliant design. Low thermal capacity construction. High repeatability and long-term stability. Compatible with standard SMT assembly processes. Gold wire bonding for reliable electrical connections. PPS (Phenylene sulphide) housing material. Silver plated copper pins. Moisture and condensation sensitive (non-waterproof construction). Specifications: Parameter Value Pressure Range: 0 ~ 100kPa (also available for -100 ~ 100kPa negative pressure) Working Temperature: -30°C ~ +125°C (-22°F ~ +257°F) Storage Temperature: -40°C ~ +140°C (-40°F ~ +284°F) Bridge Resistance: 4kΩ ~ 6kΩ (typical 5kΩ) Offset/Zero Output: -10mV ~ +10mV Full Scale Output: 60mV ~ 120mV (at 100kPa) Input Impedance: 4kΩ ~ 6kΩ Output Impedance: 4kΩ ~ 6kΩ Insulation Resistance: 100MΩ minimum at 100VDC Over Pressure: 3X rated pressure Linearity: ±0.3%FS maximum Hysteresis: ±0.2%FS maximum Repeatability: ±0.2%FS maximum Temperature Coefficient of Resistance: 1600 ~ 2600 ppm/°C TCO (Temp. Coefficient of Offset): ±0.2%FS/°C (constant voltage), ±0.05%FS/°C (constant current) TCS (Temp. Coefficient of Span): -0.26 ~ -0.2%FS/°C (constant voltage), ±0.05%FS/°C (constant current) Net Weight: 1 gram Pinout: Pin Definition 1 Vs+ (Power +) 2 GND (Ground) 3 Vo+ (Output +) 4 NC (No Connection) 5 Vo- (Output -) 6 Vs- (Power -) Footprint: Applications: Medical equipment (blood pressure monitors, patient monitoring systems). Respiratory devices (ventilators, respirators, anesthesia machines). Infusion and syringe pumps. COPD treatment devices. Kidney dialysis equipment. Air pump systems. HVAC and pneumatic controls. Process control and automation. Pressure switching applications. Air flow monitoring. Consumer electronics (printers, humidifiers, coffee machines). Industrial automation equipment. Medical cupping and cosmetology devices. Hospital beds and massage equipment. Robotics and pneumatic systems. Packages: 1x Oxygen Pressure Sensor XGZP101SB1 100KPa Definition B1 SOP-6. Documents: XGZP101SB1 Datasheet.