Universal BGA A95 Reballing Stencil Plate 31 in 1

From the shop's description

Universal BGA A95 Reballing Stencil Plate 31 in 1 The Universal BGA Reballing Stencil Plate A95 (31 in 1) is an essential tool for repairing and rebonding chips (ICs) in phones, laptops, and other electronics. It includes 31 different stencil patterns on a single plate, making it easy to work with a variety of chip sizes. Made from strong, heat-resistant steel, the stencil is durable and can be used multiple times without bending or warping. It works seamlessly with hot air rework stations or reballing machines, providing flexibility for different repair setups. The stencil is clearly labeled, so you can quickly find the right size for each chip, making your repair process more efficient. Whether you’re repairing smartphones, computers, or game consoles, this 31-in-1 stencil plate will save you time and ensure cleaner, more accurate work. It’s an ideal tool for both professionals and beginners involved in micro-soldering or chip-level repairs. Features: 31-in-1 Design: Includes 31 different stencil patterns on a single plate, compatible with various BGA chip sizes and layouts. Universal Compatibility: Suitable for a wide range of ICs used in smartphones, tablets, laptops, and gaming consoles. Heat-Resistant Material: Made from high-quality stainless steel that withstands high reflow temperatures without bending or warping. Reusable & Durable: Can be used multiple times without loss of shape or precision, making it cost-effective and long-lasting. Precision Holes: Laser-cut holes ensure accurate placement of solder balls for efficient and clean reballing. Easy Identification: Each stencil pattern is clearly labeled for quick and easy selection. Ideal for Professionals & Beginners: Simple to use, even for those new to BGA repair. Compatible with Hot Air Guns & Rework Stations: Works seamlessly with standard reballing tools and techniques. Specifications: Type: BGA Reballing Stencil (31-in-1) Material: High-quality stainless steel Number of Stencils: 31 different chip patterns Thickness: Around 0.12 mm (ultra-thin and flexible) Color: Silver (natural metal finish) Compatibility: Supports various IC chip sizes used in smartphones, tablets, laptops, and game consoles Heat Resistance: Yes – suitable for high-temperature use Reusability: Yes – can be used multiple times Markings: Laser-etched labels for each pattern Applications: The Universal BGA Reballing Stencil Plate A95 (31 in 1) is widely used in the repair and maintenance of electronic circuit boards. It is essential for reballing BGA (Ball Grid Array) chips after removal, helping to accurately place solder balls on either the chip or the motherboard. It is commonly used in: Mobile phone chip repair and replacement Laptop and gaming console motherboard repair BGA rework and reballing tasks in electronics labs Professional electronics repair workshops Technical training and soldering practice in education centers Recycling and reusing used IC chips Package: 1x BGA Reballing Stencils for A95 MTK series