RELIFE Solder Paste RL-403S 183°C

From the shop's description

RELIFE Solder Paste RL-403S 183°C RELIFE Rl-403s Low-Temperature Syringe PPD Paste 183°C. The paste is fine and the particles are fine only 20~38 microns. Excellent wettability, the surface is still wet after 36 hours of opening and does not affect the welding. Strong welding ability, high resistance, strong activity, bright and full tin. The RELIFE RL-403S is a professional-grade solder paste formulated for electronics manufacturing and rework. Based on the classic Sn63/Pb37 eutectic alloy, it provides reliable, predictable melting characteristics for strong solder joints. Its “no-clean” flux chemistry leaves minimal, non-conductive, and non-corrosive residue, often eliminating the need for a post-soldering cleaning step in many applications. The fine particle size (Type 4) makes it particularly suitable for printing or dispensing onto circuit boards with fine-pitch components and high-density layouts. It is supplied in a convenient 10CC syringe for manual application or compatibility with dispensing equipment, requiring refrigerated storage to maintain optimal performance. Features: Syringe type paste. No-cleaning/Easy tinning/No residue/Free 3 needles of different specifications + putter. 183℃ low-temperature syringe tin paste. Low-temperature lead-free solder paste customized for high-end machine motherboard repair. Suitable for sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT repair, BGA chip tin planting, etc. Dispense evenly/High purity/Delicate stickiness/Syringe design. Syringe-type paste, welding is not wasteful, more precise and the sealing plug can be reused after use. Specifications: Parameter Specification Brand: RELIFE Model: RL-403S Product Type: Solder Paste Volume: 10 CC Particle Size (Type): 20-38 µm (Type 4) Alloy Composition: Sn63/Pb37 (Tin 63% / Lead 37%) Viscosity @ 25°C: 160 – 230 Pa.s Storage Temperature: 0 – 10 °C (Refrigeration Required) Flux Type: No-Clean Approximate Weight: 15 g How to use: Application: SMT component repair and installation (resistors, capacitors, ICs). BGA chip tomb‑tin plating and reflow work. Precision soldering on motherboards, phone PCB boards, and connectors. Repair of sensors, wires, motors, fuses, and metal housings. Hobbyist and model engineering soldering tasks with fine details. Package Include: 1x RELIFE Solder Paste RL-403S 183°C.