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NVIDIA Jetson AGX Orin 64GB Developer Kit With External SSD Storage
NVIDIA Jetson AGX Orin 64GB Developer Kit With External SSD Storage, photo 2
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NVIDIA Jetson AGX Orin 64GB Developer Kit With External SSD Storage

Brand · NVIDIA

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NVIDIA Jetson AGX Orin 64GB Developer Kit With External SSD Storage he NVIDIA Jetson AGX Orin 64GB Developer Kit With External SSD Storage is a powerful embedded AI computing platform designed for developing next-generation autonomous machines and intelligent systems. Powered by the NVIDIA Orin architecture, the system delivers up to 275 TOPS of AI performance, enabling real-time processing for complex AI models, computer vision, and robotics applications. This developer kit includes the Jetson AGX Orin 64GB module integrated with a high-performance carrier board, providing extensive connectivity and flexibility for rapid prototyping and deployment. It features 64GB LPDDR5 memory with high bandwidth, allowing developers to run large AI models and multi-sensor workloads efficiently. The platform supports a wide range of high-speed interfaces including PCIe Gen4, USB 3.2, MIPI CSI camera inputs, and high-speed networking such as Gigabit Ethernet and 10GbE. This makes it suitable for robotics, industrial automation, smart surveillance, and AI edge computing solutions. To enhance storage performance and usability, this product is offered with external SSD storage options, enabling faster data access and expanded capacity for AI datasets and applications. https://makerselectronics.com/wp-content/uploads/2025/02/vid1.webm Features: • Up to 275 TOPS AI performance for advanced workloads. • NVIDIA Ampere GPU architecture with Tensor Cores. • 64GB LPDDR5 high-bandwidth memory. • Supports complex AI models and multi-stream processing. • High-speed I/O including PCIe Gen4 and USB 3.2. • M.2 Key M slot supporting NVMe SSD storage. • Multiple camera support via MIPI CSI-2 interface. • Gigabit Ethernet and 10GbE networking support. • Compatible with NVIDIA JetPack SDK ecosystem. • Ideal for robotics, AI, and edge computing applications. Specifications: arameter: Value Module – GPU: NVIDIA Ampere architecture with 2048 NVIDIA CUDA® cores and 64 tensor cores Module – CPU: 12‑core Arm Cortex‑A78AE v8.2 64‑bit CPU, 3MB L2 + 6MB L3 Module – DL Accelerator: 2x NVDLA v2.0 Module – Vision Accelerator: PVA v2.0 Module – Memory: 64GB 256‑bit LPDDR5, 204.8GB/s Module – Storage: 64GB eMMC 5.1 Module – Video Encode: 2x 4K60, 4x 4K30, 8x 1080p60, 16x 1080p30 (H.265) Module – Video Decode: 1x 8K30, 3x 4K60, 7x 4K30, 11x 1080p60, 22x 1080p30 (H.265) Module – Power: 15W–60W Carrier Board – Camera: 16‑lane MIPI CSI‑2 connector Carrier Board – PCIe: x16 PCIe slot supporting: x8 PCIe Gen4 Carrier Board – RJ45: Up to 10GbE Carrier Board – M.2 Key M: x4 PCIe Gen 4 Carrier Board – M.2 Key E: x1 PCIe Gen 4, USB 2.0, UART, I2S Carrier Board – USB Type‑C: 2x USB 3.2 Gen2 Carrier Board – USB Type‑A: 2x USB 3.2 Gen2, 2x USB 3.2 Gen1 Carrier Board – USB Micro‑B: USB 2.0 Carrier Board – DisplayPort: DisplayPort 1.4a (+MST) Carrier Board – microSD Slot: UHS‑1 cards up to SDR104 mode Carrier Board – 40‑pin Header: I2C, GPIO, SPI, CAN, I2S, UART, DMIC Carrier Board – Additional Headers: 12‑pin automation header, 10‑pin audio panel header, 10‑pin JTAG header, 4‑pin fan header, 2‑pin RTC battery backup connector Carrier Board – Buttons: Power, Force Recovery, Reset Carrier Board – Dimensions: 110mm x 110mm x 71.65mm (height includes feet, carrier board, module, and thermal solution) Configuration: Applications: • Autonomous Robotics. • Self-Driving Vehicles. • Smart Surveillance & Security. • Medical AI & Healthcare. • Industrial Automation. • AI-Powered Edge Computing. • Agricultural Technology. • Smart Cities & IoT. • Retail & Customer Analytics. • Augmented & Virtual Reality (AR/VR). Package Contents: • 1 X NVIDIA Jetson AGX Orin 64GB Developer Kit. • 1 X USB Type-C Power Adapter. • 1 X USB Type-C to Type-A cable. • 1 X Get Started booklet. Documents: • Datasheet • Getting Started Guide • Jetson Software • Jetson Download Center

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Specifications

https
//makerselectronics.com/wp-content/uploads/2025/02/vid1.webm
arameter
Value
Module – CPU
12‑core Arm Cortex‑A78AE v8.2 64‑bit CPU, 3MB L2 + 6MB L3
Module – Power
15W–60W
Module – Memory
64GB 256‑bit LPDDR5, 204.8GB/s
Module – Storage
64GB eMMC 5.1
Carrier Board – PCIe
x16 PCIe slot supporting: x8 PCIe Gen4
Carrier Board – RJ45
Up to 10GbE
Module – Video Decode
1x 8K30, 3x 4K60, 7x 4K30, 11x 1080p60, 22x 1080p30 (H.265)
Module – Video Encode
2x 4K60, 4x 4K30, 8x 1080p60, 16x 1080p30 (H.265)
Carrier Board – Camera
16‑lane MIPI CSI‑2 connector
Carrier Board – Buttons
Power, Force Recovery, Reset
Module – DL Accelerator
2x NVDLA v2.0
Carrier Board – DisplayPort
DisplayPort 1.4a (+MST)
Module – Vision Accelerator
PVA v2.0
Carrier Board – USB Type‑A
2x USB 3.2 Gen2, 2x USB 3.2 Gen1
Carrier Board – USB Type‑C
2x USB 3.2 Gen2
Carrier Board – microSD Slot
UHS‑1 cards up to SDR104 mode
Carrier Board – USB Micro‑B
USB 2.0
Carrier Board – 40‑pin Header
I2C, GPIO, SPI, CAN, I2S, UART, DMIC

Datasheet

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