MECHANIC Solder Paste XGSP80 (60gm) 183°C

Suit for cellphone repair with golden ratio in soldering paste, soldering joints solidness fullness and brightness Features : Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on Good soldering and welding tool Specification : Material: Plastic+solder paste Type: XGSP80 Alloy: Sn63/Pb37 Microns: 20-38um Flux : IPX3 Weight : 60gm Application : Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.